Encapsulation and Potting in the Electronics Industry- Things to Know

Potting refers to the process of submersing or filling a complete electronic assembly with a compound material. Original Equipment Manufacturers (OEMs) want their electrical assemblies potted for varied reasons.

But typically, potting ensures the safety of the components from shock and vibration. Potting also plays a crucial role in stopping corrosive agents from coming in contact with the components. This procedure also enhances electronic insulation.

The compounds for potting are at the forefront of electronics assembly. They deliver adequate protection in challenging environmental conditions. They also help to optimize mechanical strength and protect the user from electrical shocks. Here are some essential aspects to know about electrical potting.

The Types of Potting Compounds for Effective Electronics Encapsulation

Here are the types of potting compounds typically used for the encapsulation of electronic components.

Urethanes

Urethanes are more flexible compared to other compounds. They offer better performance in components with thermal cycling. You can use urethane potting compounds in low-temperature environments. But urethane is not resistant to chemicals. It also cannot withstand high temperatures.

Silicones  

In the electronics industry, potting compounds containing silicones are widely used. Silicones provide excellent flexibility and operate through the broadest temperature range. However, silicone is not suitable for components with higher thermal cycling.

Epoxies

Epoxies provide excellent chemical and temperature resistance. OEMs usually leverage epoxies in high-voltage electrical systems.

What’s Involved in the Potting Process?

The potting process involves filling the electronic component with a compound that offers better resistance to vibration and shock. This procedure can keep corrosive agents and moisture out of the components.

The specialist will place the electronic component in a mold. The technician will fill the mold with epoxy or other potting compounds. When the material hardens, the electronic assembly will be permanently secured.    

The Right Time to Use Potting

When the context is about impact resistance and effective insulation, potting is the preferred option. It is also an ideal choice if your device needs to withstand rough mechanical abrasion. This procedure is effective when you need to:

• Reduce vibration dampening
• Secure the intricate components of the device
• Control heat dissipation

Most OEMs also use colored potting compounds to obscure the circuit board. By obscuring the circuit board, manufacturers can prevent reverse engineering of their products.

Factors to Consider while Selecting the Best Compounds for Potting

Here are some factors you should consider while selecting the best potting compounds.

• Viscosity

Most electronic and electrical components require low-viscous compounds. While procuring potting compounds, ensure that you know about their viscosity level.

• Color

You need to buy the potting compound of the correct color if the aesthetics of the product are essential. For instance, if the product has LEDs, you need transparent potting compounds.

• Thermal Conductivity

Select potting compounds available with higher thermal conductivity. When a compound has higher thermal conductivity, it can effectively manage the heat generated by electronic devices.

• Hardness

The more complex compounds offer better weather resistance.

OEMs should purchase a suitable electrical potting compound to secure their products. If you want to buy the best quality potting compounds, Raytech Gels is your best bet. They have their own dedicated labs to ensure maximum reliability to users.