Bonding Crystal

Diffusion Bonding Crystal is a kind of product that combines laser Crystal with pure uniform substrate product by thermal Diffusion Bonding technology. The Bonding product can efficiently decrease the thermal lensing effect of laser Crystal under the problem of high-power pumping.

Crystal bonding describes the interactions of atoms, ions, or particles that make up a crystal. Fundamentally, it depends on the Coulomb communication between particles, but it can be split into van der Waals pressure (or van der Waals pressure), ionic bond, covalent bond, metal bond and also hydrogen bond in terms of its symptom.

Crystal bonding innovation is the uniform or heterogeneous crystal products, crystal preparation (that is, surface area processing), cleaning, activation therapy, without using any type of bonding product, under certain conditions straight match one, crystal via van der Waals force, molecular force, even atomic force with each other.

Crystal bonding modern technology plays a crucial role in the study of brand-new optical gadgets and also brand-new solid-state lasers.

Bonding process

Bonding: electrostatic bonding, hot bonding, "composite" bonding. The function of bonding is to "bond" numerous substratum by an outside activity. Various bonding modes, different bonding principles

1. Electrostatic bonding:

Suggested by Wallis as well as Pomerantz in 1969, electrostatic bonding is an approach to bonding glass with metals, alloys or semiconductors without any binder
Principle:

• Borosilicate glass and phosphosilicate glass soften at a specific temperature and behave like electrolytes. Under the applied voltage, the positive ion (Na) wanders in the direction of the cathode and also creates an area fee area at the anode. The drift stops when the used voltage falls on the room fee region
• As an example, silicon connects the anode, glass attaches the cathode, silicon and also glass contact, as well as the adverse room cost region formed at the interface reacts with silicon, creating the chemical bond Si-o-Si, as well as finishing the bond
• Spots the conclusion of the bond by discovering the existing

2. Warm bonding:

after high-temperature treatment, the silicon wafers have directly adhered to each other.

• Straight Silicon bonding (SDB).
• Silicon Blend bonding (SFB).
• Straight sample bonding (DWB).

3. "Compound" bonding.

Bonding is accomplished by the reaction between the intermediate layers.

• Bond with silicide: NiSi, PtSi, TiSi2, etc - Making the most of the low mutual melting point (around 400 degrees) of silicon and also gold.
• Amorphous silicon.

Benefits of Bonding Crystal.

• Reduces thermal lensing results brought on by end surface deformation.
• Enhances light-to-light conversion efficiency.
• Raises the damage resistance limit.
• Boosts the outcome beam of light quality of the laser.
• Reduces the volume.

crylink uses surface area triggered bonding modern technology, which is a reduced temperature or area temperature bonding technology, normally identified by surface area cleaning and also surface area activation. Before bonding, the bonding surface area can be pestered by fast atoms or ion beams of light, which can effectively enhance the bonding toughness and also accomplish high-grade bonding between not natural products, metals and also semiconductor products.

Compared to the heat warm bonding technique, the surface area triggered bonding innovation has a greater bonding pressure interface, and much better control of optical absorption loss as well as surface form modification, while the impurities externally of thermal diffusion bonding can not be eliminated and also are adhered to the binding surface. The surface turned-on bonding technology has the advantages of eliminating recurring elements of polishing, getting rid of natural contaminants, getting rid of the surface area oxide layer, damaging chemical bonds of products, as well as enhancing activation energy.